Touch panel module, touch device and manufacturing method thereof

ABSTRACT

A touch panel module includes a substrate, a sensor layer disposed on the substrate, a first glue layer disposed on the sensor layer and an anti-electromagnetic interference layer disposed on the first glue layer. The touch panel module with anti-electromagnetic interference can be formed independently, and may be combined with other electronic device to form a touch device, thereby reducing the thickness of the touch device and simplifying the process steps.

BACKGROUND OF THE INVENTION

All related applications are incorporated by reference. The presentapplication is based on, and claims priority from, China applicationSerial Number No. 201210350412.9, filed on Sep. 20, 2012, the disclosureof which is hereby incorporated by reference herein in its entirety.

FIELD OF THE INVENTION

The present invention relates to the field of touch input technology andmore particularly to a touch panel and a manufacturing method thereof.

DESCRIPTION OF THE RELATED ART

Nowadays, personal digital assistants (PDA), mobile phones, notebookcomputers, tablet PCs and other portable electronic products are widelyused in modern life. Since these electronic products need to be thin andlight, the traditional input devices, such as keyboards or mice have tobe replaced with other input devices. Further, as the need for tabletPCs has greatly increased, touch panel technology has become one of thekey technologies in electronic products.

Generally, a touch panel is disposed on an electric device, since thetouch panel tends to easily get affected by external electromagneticinterferences or the electromagnetic noise generated by the electronicdevices. Hence, reducing these electromagnetic interferences andimproving the stability of a touch panel has become one of importantissues. Generally, a touch panel further comprises ananti-electromagnetic interference layer to reduce the interferences.However, the anti-electromagnetic interference layer is usually aconductive layer disposed on another substrate, so the thickness of thetouch panel increases when the touch panel comprises an additionalanti-electromagnetic interference layer (anti interference conductivelayer), and the manufacturing process becomes more complicated.

BRIEF SUMMARY OF THE INVENTION

The disclosure provides a method for forming a touch panel process whichcan be simplified. During the manufacturing process of a touch panel, ananti interference conductive layer can be formed on an adhesive layer,there is no need to combine a anti interference conductive layer withthe touch panel, and the manufacturing method can be simplified.

The present invention provides a touch panel module, comprising asensing layer disposed on a substrate, a first adhesive layer disposedon the sensing layer, andan anti interference conductive layer, disposedon and directly formed on the first adhesive layer.

One embodiment of the present invention further comprises a protectivelayer disposed between the first adhesive layer and the sensing layer.

One embodiment of the present invention further comprises a flat filmdisposed between the substrate and the sensing layer.

One embodiment of the present invention further comprises a shadingframe disposed between the substrate and the sensing layer.

In one embodiment of the present invention, the anti interferenceconductive layer can be indium tin oxides (ITO), indium zinc oxide(IZO), zinc oxide doping 3 oxidation 2 aluminum (AZO) or other solidconductive material.

In one embodiment of the present invention, the anti interferenceconductive layer can be nano silver, carbon nano tube (CNT), silverglue, poly (3,4-ethylenedioxythiophene) poly (styrene sulfonate) (PEDOT:PSS) or other liquid conductive material.

The present invention further provides a touch device, including a touchpanel module comprising a sensing layer disposed on a substrate, a firstadhesive layer disposed on the sensing layer and an anti interferenceconductive layer, disposed on and directly formed on the first adhesivelayer, an electric device, a second adhesive layer disposed between theanti interference conductive layer and the electric device.

In one embodiment of the present invention, the electric device can be adisplay module or a circuit board.

The present invention further provides a method for forming a touchpanel module, comprising the following steps: first, a sensing layer isformed on a substrate, a first adhesive layer is then formed on thesensing layer, and an anti interference conductive layer is formed onthe first adhesive layer.

One embodiment of the present invention further comprises forming anelectric device on the anti interference conductive layer, and forming asecond adhesive layer between the anti interference conductive layer andthe electric device.

One embodiment of the present invention further comprises performing apre-treatment process on the first adhesive layer.

In one embodiment of the present invention, the pre-treatment processcomprises a deep ultraviolet irradiation process, a shallow ultravioletirradiation process or a plasma process.

In one embodiment of the present invention, the wavelength of the lightsource of the deep ultraviolet irradiation process and the shallowultraviolet irradiation process is between 160˜190 nm (nanometer), andthe irradiation time is between 180˜240 sec.

In one embodiment of the present invention, the plasma process comprisesinputting 100˜140 ml (milliliter) of argon and 60˜100 ml of oxygen perminute, the pressure is between 35˜55 Pa, and the processing time isbetween 800˜1000 sec.

In one embodiment of the present invention, the formation step of theanti interference conductive layer comprising: forming the antiinterference conductive layer made of a liquid conductive material onthe first adhesive layer.

One embodiment of the present invention further comprises performing apre-treatment process on the liquid conductive material.

In one embodiment of the present invention, the pre-treatment processcomprises adding a co-solvent in the liquid conductive material.

In one embodiment of the present invention, the co-solvent comprisesethanol and dimethyl sulfoxide.

In one embodiment of the present invention, the volume ratio of theliquid conductive material and the co-solvent is 1:1˜4.

The touch panel module of the present invention comprises an adhesivelayer formed directly on the anti interference conductive layer, so asto have the touch panel module have anti interference functions. Thetouch panel module can be formed independently, and can be easilycombined with other elements. For example, it can be combined with adisplay device or a circuit board, without the need for anothersubstrate to form the anti interference conductive layer, therebyeffectively reducing the thickness of the touch panel, and simplifyingthe manufacturing process.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional diagram showing a touch panel moduleaccording to the first preferred embodiment of the present invention.

FIG. 2 is a cross sectional diagram showing a touch panel moduleaccording to the second preferred embodiment of the present invention.

FIG. 3 is a cross sectional diagram showing a touch panel moduleaccording to the third preferred embodiment of the present invention.

FIG. 4 is a cross sectional diagram showing a touch panel moduleaccording to the fourth preferred embodiment of the present invention.

FIG. 5 is a cross sectional diagram showing a touch device according tothe first preferred embodiment of the present invention.

FIG. 6 is a flow chart showing the method for forming a touch deviceaccording to the first preferred embodiment of the present invention.

DETAILED DESCRIPTION

To provide a better understanding of the present invention to usersskilled in the technology of the present invention, preferredembodiments are detailed as follows. The preferred embodiments of thepresent invention are illustrated in the accompanying drawings withnumbered elements to clarify the contents and effects to be achieved.

Please note that the figures are only for illustration and the figuresmay not be to scale. The scale may be further modified according todifferent design considerations. When referring to the words “up” or“down” that describe the relationship between components in the text, itis well known in the art and should be clearly understood that thesewords refer to relative positions that can be inverted to obtain asimilar structure, and these structures should therefore not beprecluded from the scope of the claims in the present invention.

Referring to FIG. 1 which is a cross sectional diagram showing a touchpanel module according to the first preferred embodiment of the presentinvention. As shown in FIG. 1, a touch panel module 10 comprises asubstrate 12, a sensing layer 14, a first adhesive layer 20 and an antiinterference conductive layer 22. The substrate 12 can be made oftransparent material or opaque material, not limited to be a rigidsubstrate or a flexible substrate, such as glass, polycarbonate (PC),polyethylene terephthalate (PET), polymethylmesacrylate (PMMA),polysulfone (PES) or other cyclic olefin copolymer material.

The sensing layer 14 is formed on the substrate 12, wherein the sensinglayer 14 includes a plurality of first electrodes arranged along a firstdirection and a plurality of second electrodes arranged along a seconddirection, and a plurality of traces which one end of each trace iselectrically connected to each first electrode or each second electrode,wherein the other end of each trace is electrically connected to aoutside controller (not shown), but not limited thereto.

The first adhesive layer 20 is disposed on the sensing layer 14, and theanti interference conductive layer 22 is disposed on the first adhesivelayer 20. The first adhesive layer 20 can be optical curing glue,humidity curing glue, thermosetting glue or other glue used for bonding.The anti interference conductive layer 22 can be a solid film, attachedon the first adhesive layer 20, or formed on the first adhesive layer 20through spin coating, plating, sputtering, printing or other methods.The anti interference conductive layer 22 can be made of solidconductive material or liquid conductive material, with solid conductivematerial such as indium tin oxides (ITO), indium zinc oxide (IZO), zincoxide doping 3 oxidation 2 aluminum (AZO); and liquid conductivematerial such as nano silver, carbon nano tube (CNT),poly(3,4-ethylenedioxythiophene) poly styrene sulfonate (PEDOT:PSS), orother metal like silver glue. Due to the anti interference conductivelayer 22 being formed directly on the first adhesive layer 20, the touchpanel module 10 intrinsically has an anti-electromagnetic interferencefunction.

Besides, others elements may further be added to the touch panel module10, and achieve different embodiments of the present invention. Thefollowing description will detail the different embodiments of the touchpanel of the present invention. To simplify the description, thefollowing description will detail the dissimilarities among thedifferent embodiments and the identical features will not be redundantlydescribed. In order to compare the differences between the embodimentseasily, the identical components in each of the following embodimentsare marked with identical symbols.

FIG. 2 is a cross sectional diagram showing a touch panel moduleaccording to the second preferred embodiment of the present invention.As shown in FIG. 2, a touch panel module 10′ comprises the substrate 12,the sensing layer 14, the first adhesive layer 20 and the antiinterference conductive layer 22. The difference between this embodimentand the first preferred embodiment is that the touch panel 10′ furthercomprises a protective layer 24 disposed between the first adhesivelayer 20 and the sensing layer 14. The protective layer 24 is usually aninsulating film that covers and protects the sensing layer 14 from beingdamaged. The material of the protective layer 24 can be selected fromthe group of polyimide (PI), ink, S₃N₄ or SiO₂, but not limited thereto.It is worth noting that the protective layer 24 is selectively formedaccording to actual requirements. The other components, materialproperties, and manufacturing method of the touch panel 10′ are similarto those of the first preferred embodiment detailed above and will notbe redundantly described.

FIG. 3 is a cross sectional diagram showing a touch panel moduleaccording to the third preferred embodiment of the present invention. Asshown in FIG. 3, the touch panel module 10″ comprises the substrate 12,the sensing layer 14, the first adhesive layer 20 and the antiinterference conductive layer 22. The difference between this embodimentand the first preferred embodiment is that the touch panel 10″ furthercomprises a flat film 18 disposed between the sensing layer 14 and thesubstrate 12. The flat film 18 is preferably made of non-conductivematerial. The flat film 18 covers the upper surface or the lower surfaceof the substrate 12, or may also cover the upper surface and the lowersurface simultaneously to solve the issue of unevenness of the uppersurface and the lower surface of the substrate 12, so that the sensinglayer 14 can be formed on a flat surface. The flat film 18 may also be asmoothing layer made of polymer material, such as polyimide (PI), ormade of inorganic material such as Si₃N₄ or SiO₂, but the presentinvention is not limited thereto. It is worth noting that thisembodiment can be combined with the second embodiment; in other words,the touch panel module 10″ may further have a protective layer 24disposed between the first adhesive layer 20 and the sensing layer 14.The other components, material properties, and manufacturing method ofthe touch panel 10″ are similar to those of the first preferredembodiment detailed above and will not be redundantly described.

FIG. 4 is a cross sectional diagram showing a touch panel moduleaccording to the fourth preferred embodiment of the present invention.As shown in FIG. 4, the touch panel module 10′″ comprises the substrate12, the sensing layer 14, the first adhesive layer 20 and the antiinterference conductive layer 22. The difference between this embodimentand the first preferred embodiment is that the touch panel 10′″ furthercomprises a shading frame 16 disposed between the sensing layer 14 andthe substrate 12, the shading frame 16 is usually made of opaquematerial such as dark photoresist. The shading frame 16 covers theperiphery region of the substrate 12, to hide some electric elements notto be exposed on the user interface. It is worth noting that thisembodiment can be combined with the second or the third embodiments, inother words, the touch panel module 10′″ may further have a protectivelayer 24 disposed between the first adhesive layer 20 and the sensinglayer 14, or further comprises a flat film 18 disposed between thesensing layer 14 and the substrate 12, wherein the flat film 18 maycover the substrate 12 and the shading frame 16, or only cover thecentral region of the substrate 12 and not extend to the shading frame16 top, so as to have the top surface of the shading frame 16 to be onthe same level as the top surface of the flat film 18. The othercomponents, material properties, and manufacturing method of the touchpanel 10′″ are similar to those of the first preferred embodimentdetailed above and will not be redundantly described.

The protective layer 24, the shading frame 16 and the flat film 18mentioned above can be selective added in the touch panel module 10 ofthe present invention according to actual requirements. The variouscombinations should be covered in the scope of the present invention. Inaddition, when the touch panel module 10 only has one substrate 12,wherein the substrate 12 can be a cover lens of the touch panel, and thesensing layer 14 is directly formed on the substrate 12, it forms atouch on lens (TOL) structure.

The feature of the present invention is that the anti interferenceconductive layer 22 is formed directly on the first adhesive layer 20 ofthe touch panel module 10, so the touch panel module 10 intrinsicallyhas an anti-electromagnetic interference function. In addition, thetouch panel module 10 can be formed independently, and be combined withother electric devices to become a touch device, and there is no need toform another anti interference conductive layer when combined.

The touch panel modules 1010′″ of the first to fourth embodimentsmentioned above can be combined with an electric device to become atouch device. Here are some examples describing the combination of thetouch panel module 10 and electronic devices. FIG. 5 is a crosssectional diagram showing a touch device according to the firstpreferred embodiment of the present invention.

As shown in FIG. 5, a touch device 30 comprises the touch panel module10, a second adhesive layer 34 and an electric device 32. The secondadhesive layer 34 is disposed between the touch panel module 10 and theelectric device 32 to bond the touch panel module 10 to the electricdevice 32.

The touch panel module 10 is disposed on the electric device 32 used asa touch input device. In this embodiment, the touch panel module 10 withthe anti-electromagnetic interference function is combined with theelectric device 32, and achieves the touch device 30. When the touchdevice 30 is used as a display device such as a touch display panel, theelectric device 32 can be a display module, such as a liquid crystallayer, a color filter, a circuit board or a backlight module, but notlimited thereto, especially if the touch device 30 is used as anon-display device. Further, the substrate 12 is a transparentsubstrate, and the sensing layer 14 is made of transparent material whenthe electric device 32 is a display module.

In the touch panel module 10 of the present invention, the antiinterference conductive layer is directly formed on the first adhesivelayer 20 so the structure can easily be combined with others electricdevices, and only needs have the second adhesive layer formed betweenthe touch panel module 10 and the electric device 32 to bond them oneanother, and does not need any other substrate to introduce the antiinterference conductive layer, thereby reducing the thickness of theelectric device 32, and simplifying the manufacturing process. Althoughthis embodiment uses the touch panel module 10 combined with theelectric device 32 in this example, the present invention is not limitedthereto; the touch panel modules 10′, 10″ or 10′″ of the second tofourth preferred embodiments can also be combined with the electricdevice 32 to achieve touch devices of different embodiments. It can beunderstood that the various embodiments should be comprised in the scopeof the present invention.

The touch panel module and the touch device mentioned above can beformed through the manufacturing processes provided by the presentinvention. Please refer to FIG. 1 and FIG. 6, FIG. 6 is a flow chartshowing the method for forming a touch device according to the firstpreferred embodiment of the present invention. The method comprises stepS10: providing a substrate 12; step S12: forming a sensing layer 14 onthe substrate 12; step S14: forming a first adhesive layer 20 on thesensing layer 14, and step S16: forming an anti interference conductivelayer 22 on the first adhesive layer 20, wherein the material of theanti interference conductive layer 22 includes solid conductive materialor liquid conductive material.

Generally, when the material of the anti interference conductive layer22 is a solid conductive material, the anti interference conductivelayer 22 can be formed through a sputtering, an electroplating, or afilm lamination method on the surface of the first adhesive layer 20.However, the adhesivity on surface of the first adhesive layer 20 ishigher, in order to improve the formation of the anti interferenceconductive layer 22, or to avoid the issue of unevenness of the surfaceof the anti interference conductive layer 22. The present inventiontherefore selectively comprises performing a pre-treatment process onthe first adhesive layer 20 before the formation of the antiinterference conductive layer 22. The pre-treatment process may be adeep ultraviolet irradiation process, a shallow ultraviolet irradiationprocess or a plasma process. The wavelength of the light source of thedeep ultraviolet irradiation process and the shallow ultravioletirradiation process is between 160˜190 nm (nanometer), and theirradiation time is between 180˜240 sec. The plasma process comprisesinputting 100˜140 ml (milliliter) of argon and 60˜100 ml of oxygen intothe chamber per minute, wherein the pressure is between 35˜55 Pa, andthe processing time is between 800˜1000 sec. But the parameter mentionedabove can be adjusted according to actual requirements, and the presentinvention is not limited thereto.

When the material of the anti interference conductive layer 22 is aliquid conductive material, since the anti interference conductive layer22 is incompatible with the first adhesive layer 20, so the antiinterference conductive layer 22 can not be formed on the first adhesivelayer 20 without performing any pre-treatment process. The firstadhesive layer 20 may undergo the pre-treatment process mentioned above.Besides, apart from performing the pre-treatment process on the firstadhesive layer 20, the anti interference conductive layer 22 made ofliquid conductive material may also undergo a pre-treatment process thatincludes adding a co-solvent into the conductive liquid, for example,when the main component of the conductive liquid is a high conductivitymolecules component (such as PEDOT:PSS), the co-solvents preferably areethanol and dimethyl sulfoxide (DMSO) wherein the volume ratio of theconductive liquid, ethanol and DMSO is preferably 1:1˜3:0.1˜0.5. Whenthe main component of the anti interference conductive layer 22 is nanosilver, the co-solvents preferably are ethanol and DMSO, wherein thevolume ratio of the conductive liquid, ethanol and DMSO is preferably1:1˜3:0.3˜0.8. In sum, the volume ratio of the conductive liquid to theco-solvents is about 1:1˜4. However, the present invention is notlimited thereto, others adjusted volume ratios should be comprised inthe scope of the present invention.

After the anti interference conductive layer 22 is composed by a certainpercentage, mixed and filtered, the liquid conductive material can becoated on the first adhesive layer 20 through direct coating, spincoating, electroplating, printing or other methods. Afterwards, anotherfilm-forming step is needed to form the liquid conductive material onthe anti interference conductive layer 22. The film-forming step can beadjusted according to the different compositions of the antiinterference conductive layer 22; for example, if the liquid conductivematerial is PEDOT:PSS or other similar material, it may be dried invacuum for about 5˜20 minutes, or be heated at 30˜100° C. for about10˜50 minutes; If the liquid conductive material is nano silver or othersimilar material, it is preferably heated at 60˜50° C. for about 90˜120minutes. It is worth nothing that the pre-treatment process which isperformed on the first adhesive layer 20 is different from thepre-treatment processes which is performed on the anti interferenceconductive layer 22, but it is not limited thereto. The presentinvention comprises performing one of those two pre-treatment processes,or, preferably, performing both of those two pre-treatment processes topromote the formation of the anti interference conductive layer 22 onthe first adhesive layer 20.

In addition, the manufacturing method mentioned above may furthercomprise forming a shading frame between the substrate and the sensinglayer, the shading frame covers the periphery region of the substrate,to shade extra light and enhance the appearance. A flat film can beselectively formed on the upper surface or the lower surface of thesubstrate to solve the issue of unevenness of the substrate surface. Itis worth noting that the shading frame and the flat film can be formedrespectively, and do not need to coexist. A protective layer can beselectively formed between the sensing layer and the first adhesivelayer, to avoid the sensing layer from further damages. Of course, thepresence of the shading frame, the flat film and the protective layerare not limited. The shading frame, the flat film and the protectivelayer can be combined with the touch panel of the present invention. Allvarious combinations should be comprised in the scope of the presentinvention. The material and the manufacturing methods of the shadingframe, the flat film and the protective layer described here are similarto those of the preferred embodiments shown in FIGS. 2-4 and will not beredundantly described.

The steps S10˜S16 mentioned above describe the process for forming thefirst preferred embodiment of the present invention. Besides, after thetouch panel module is formed, the present invention further comprisesstep S20: forming a second adhesive layer on the anti interferenceconductive layer, and step S22: forming an electric device on the secondadhesive layer, to combine the touch panel module with the electricdevice, thereby completing a touch device. In addition, the shadingframe, the flat film and the protective layer can also be combined withthe touch device of the present invention. The touch device of thepresent invention is a touch panel, or other opaque touch devices. Whenthe touch device is a touch panel, each layer (comprising the substrate,the sensing layer, the first adhesive layer and the anti interferenceconductive layer) are preferably made of transparent material in orderto achieve the translucent effect. On the contrary, when the touchdevice is another opaque touch device, the material of those layers arenot limited thereto. The other components, material properties, andmanufacturing methods of this embodiment are similar to those of thefirst to fourth preferred embodiments detailed above and will not beredundantly described.

In summary, the touch panel module of the present comprises an adhesivelayer directly formed on the anti interference conductive layer, so thatthe touch panel module provides anti interference functions. The touchpanel module can be formed independently, and can be easily combinedwith others elements. For example, it can be combined with a displaydevice or a circuit board, with no need for another substrate to formthe anti interference conductive layer, thereby the thickness of thetouch panel can effectively be reduced, and the manufacturing processcan be simplified.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A touch panel module, comprising: a sensing layerdisposed on a substrate; a first adhesive layer disposed on the sensinglayer; and an anti interference conductive layer, disposed on anddirectly formed on the first adhesive layer.
 2. The touch panel moduleof claim 1, further comprising a protective layer disposed between thefirst adhesive layer and the sensing layer.
 3. The touch panel module ofclaim 1, further comprising a flat film disposed between the substrateand the sensing layer.
 4. The touch panel module of claim 1, furthercomprising a shading frame disposed between the substrate and thesensing layer.
 5. The touch panel module of claim 1, wherein thematerial of the anti interference conductive layer is indium tin oxides(ITO), indium zinc oxide (IZO), or zinc oxide doping 3 oxidation 2aluminum (AZO).
 6. The touch panel module of claim 1, wherein thematerial of the anti interference conductive layer is nano silver,carbon nano tube (CNT), silver glue, or poly(3,4-ethylenedioxythiophene)poly (styrene sulfonate) (PEDOT:PSS).
 7. A touch device, comprising: atouch panel module comprises a sensing layer disposed on a substrate, afirst adhesive layer disposed on the sensing layer and an antiinterference conductive layer formed on the first adhesive layerdirectly; an electric device; a second adhesive layer disposed betweenthe anti interference conductive layer and the electric device.
 8. Thetouch device of claim 7, wherein the electric device is a display moduleor a circuit board.
 9. The touch device of claim 7, further comprising aprotective layer, disposed between the first adhesive layer and thesensing layer.
 10. The touch device of claim 7, further comprising aflat film, disposed between the substrate and the sensing layer.
 11. Thetouch device of claim 7, further comprising a shading frame, disposedbetween the substrate and the sensing layer.
 12. The touch device ofclaim 7, wherein the material of the anti interference conductive layeris indium tin oxides (ITO), indium zinc oxide (IZO), or zinc oxidedoping 3 oxidation 2 aluminum (AZO).
 13. The touch device of claim 7,wherein the material of the anti interference conductive layer is nanosilver, carbon nano tube (CNT), silver glue, orpoly(3,4-ethylenedioxythiophene) poly (styrene sulfonate) (PEDOT:PSS).14. A method for forming a touch panel module, comprising the followingsteps: forming a sensing layer on a substrate; forming a first adhesivelayer on the sensing layer; and forming an anti interference conductivelayer on the first adhesive layer.
 15. The method of claim 14, furthercomprising forming an electric device on the anti interferenceconductive layer, and forming a second adhesive layer between the antiinterference conductive layer and the electric device.
 16. The method ofclaim 15, wherein the electric device is a display module or a circuitboard.
 17. The method of claim 14, further comprising forming aprotective layer between the first adhesive layer and the sensing layer.18. The method of claim 14, further comprising forming a flat filmbetween the substrate and the sensing layer.
 19. The method of claim 14,further comprising forming a shading frame between the substrate and thesensing layer.
 20. The method of claim 14, wherein the material of theanti interference conductive layer is indium tin oxides (ITO), indiumzinc oxide (IZO), or zinc oxide doping 3 oxidation 2 aluminum (AZO). 21.The method of claim 14, wherein the material of the anti interferenceconductive layer is nano silver, carbon nano tube (CNT), silver glue, orpoly(3,4-ethylenedioxythiophene) poly (styrene sulfonate) (PEDOT:PSS).22. The method of claim 14, further comprising performing apre-treatment process on the first adhesive layer.
 23. The method ofclaim 22, wherein the pre-treatment process comprises a deep ultravioletirradiation process, a shallow ultraviolet irradiation process or aplasma process.
 24. The method of claim 23, wherein the wavelength ofthe light source of the deep ultraviolet irradiation process and theshallow ultraviolet irradiation process is between 160˜190 nm(nanometer), and the irradiation time is between 180˜240 sec.
 25. Themethod of claim 23, wherein the plasma process comprises inputting100˜140 ml (milliliter) of argon and 60˜100 ml of oxygen per minute, ata pressure comprised between 35˜55 Pa, and with a processing timecomprised between 800˜1000 sec.
 26. The method of claim 21, wherein theformation step of the anti interference conductive layer comprisesforming the anti interference conductive layer made of a liquidconductive material on the first adhesive layer.
 27. The method of claim26, further comprising performing a pre-treatment process on the liquidconductive material.
 28. The method of claim 27, wherein thepre-treatment process comprises adding a co-solvent in the liquidconductive material.
 29. The method of claim 28, wherein the co-solventis ethanol or dimethyl sulfoxide.
 30. The method of claim 28, whereinthe volume ratio of the liquid conductive material to the co-solvent is1:1˜4.